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VMZ-K3040 / VMZ-K6555

基本介紹： A ground-breaking multifunctional video measuring system developed on the strength of Nikon’s leading optomechatronics technology. 24小時(shí)咨詢熱線：

18912336076/13775115499/18912337898

A ground-breaking multifunctional video measuring system developed on the strength of Nikon’s leading optomechatronics technology.

Incorporates confocal technology, brightfield with a 15X zoom, and Laser AF. No matter what geometrical measurements are needed, two-dimensional or three-dimensional, inspection and evaluation is exceptionally fast and accurate.

The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages, such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.


Features

  • Simultaneous wide-area height measurements with Nikon proprietary confocal optics

  • 2D measurement with 15x brightfield zoom optics

  • Fully compatible with 300 mm wafer measurement at semiconductor fabs

Applications

  • IC Packages

    • Flip Chip/COF(Bump)/COG

    • CSP (FBGA)/SIP (Bump, Wire)

    • Interposer (Pad height)

  • MEMS

  • Probe Card (Silicon Probe, Au Probe)

  • Precise Glass Components (Micro Lens, Contact Lens)

  • Photo Spacer Width/Height for Color Filter for FPD Panel


A ground-breaking multifunctional video measuring system developed on the strength of Nikon’s leading optomechatronics technology.

Incorporates confocal technology, brightfield with a 15X zoom, and Laser AF. No matter what geometrical measurements are needed, two-dimensional or three-dimensional, inspection and evaluation is exceptionally fast and accurate.

The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages, such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.


Features

  • Simultaneous wide-area height measurements with Nikon proprietary confocal optics

  • Handles printed circuit board sizes with its 650 x 550 mm stroke

Applications

  • IC Packages

    • Flip Chip/COF(Bump)/COG

    • CSP (FBGA)/SIP (Bump, Wire)

    • Interposer (Pad height)

  • MEMS

  • Probe Card (Silicon Probe, Au Probe)

  • Precise Glass Components (Micro Lens, Contact Lens)

  • Photo Spacer Width/Height for Color Filter for FPD Panel


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下一篇：NEXIV VMZ-H3030

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